Mediatek has launched two new premium chipsets for smartphones today and they include the Mediatek Dimensity 8000 and the Mediatek Dimensity 8100 chipset. They are premium chipsets produced on TSMC’s 5nm process and borrow some premium features from the flagship Dimensity 9000.
They are octa-core chipsets of course and they are expected to appear in the future Xiaomi and Realme smartphones within the first quarter of this year. The new chipsets are said to bring flagship level performance at an affordable price.
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Mediatek Dimensity 8000
The Dimensity 8000 chipset uses an octa-core processor with four Arm Cortex-A78 cores clocked at up to 2.75GHz and four Arm Cortex-A55 cores clocked at up to 2.0GHz. It has an Arm Mali-G610 MC6 GPU that supports an FHD+ display at a peak refresh rate of 168Hz.
There is also support for 4K AV1 media decoding. The chipset also comes with magiq 780 ISP, which offers support for simultaneous dual camera HDR video recording, 200MP camera support, AI-Motion unblur, AI-NR/HDR photos, and 2x lossless zoom.
Connectivity-wise, the Dimensity 8000 packs a 3GPP Release-16 5G modem that offers 5G Dual SIM Dual Standby support, peak downlink performance of 4.7Gbps, and 2CC Carrier Aggregation (200MHz).
Other connectivity features include Bluetooth 5.3, Wi-Fi 6E 2×2, Bluetooth LE Audio with Dual-Link True Wireless Stereo support, and Deidou III-B1C signal support.
Mediatek Dimensity 8100
The Mediatek Dimensity 8100 chipset offers a minor improvement over the Dimensity 8000. It comes with the same four Arm Cortex-A78 cores and four Arm Cortex-A55 cores. However, the Cortex-A78 performance cores on the Dimensity 8100 can boost up to 2.85GHz.
The company also said that the Dimensity 8100 has an improved gaming performance of about 20% over the Dimensity 8000 and 25% in the CPU department.
So far, the smartphones that are expected to come with this Dimensity 8100 in the first quarter of this year is the Realme GT Neo 3 and the Redmi K50 series.
